At CFIA 2026 in Rennes, Sidel will present integrated solutions for primary, secondary and tertiary packaging, focusing on line efficiency, product quality and sustainability for the food industry.
At Mobile World Congress 2026 in Barcelona, Dassault Systèmes will present 3DExperience solutions for scalable artificial intelligence and virtual twins. The offering targets integrated industrial sectors, including data centers, semiconductors and 5G networks.
At JEC World 2026, Syensqo will present a composites portfolio for aerospace and automotive applications focused on high-rate manufacturing, sustainable resin systems and circular solutions, including recycling and bio-based feedstocks.
At Warsaw Pack Expo 2026, the adapa Group will present flexible packaging solutions made of mono-PE, mono-PP and paper, designed for recycling in the context of upcoming PPWR requirements.
For personal reasons, Bernard Charlès is stepping down as chairman of the Board of Directors of Dassault Systèmes. As of 21 February 2026, this role will be assumed by Pascal Daloz, who will combine it with the position of CEO.
Indonesia, the largest economy in Southeast Asia, is rapidly developing its plastics market with a focus on sustainable packaging and lightweight components for the automotive sector. EPR regulations and investments in new production capacities are accelerating the transition towards a circular economy.
Orex rotomoulding machines use R4 closed cable carriers and igus readychain systems, which reduce cable failure risk in demanding operating conditions and facilitate installation servicing.
Xenia Materials announces the launch of Xelamid at JEC World 2026, a family of impact-modified PA11 and PA12-based polyamides featuring increased impact strength, elongation at break and stable properties under elevated humidity conditions.
Clariant has obtained European Commission approval for renewable rice bran wax-based additives for plastics intended for food contact, strengthening their position as a regulatory-compliant alternative to traditional montan waxes in packaging applications.
At Plastindia 2026, BOY and its Indian representative Karan Engineering Co. presented on a BOY 50 E injection moulding machine an application for liquid silicone seals for automotive connectors, attracting strong interest from trade visitors.
At interpack 2026, three halls will be dedicated to processing and packaging technologies for confectionery and baked goods. Sustainable materials, flexible machinery and digital solutions for the confectionery market will be in the spotlight.
Sidel received two SEAL Business Sustainability Awards 2026 for its EvoBLOW Laser blow-moulding system and SWING Evo tunnel pasteurizer, awarded in the Sustainable Innovation Award and Sustainable Product Award categories respectively.
