SACMI acquires majority stake in Groupe Emballage Technologies
SACMI acquires a 65% stake in the French Groupe Emballage Technologies, strengthening its position in the food packaging sector and its presence in the French and other markets.
SACMI acquires a 65% stake in the French Groupe Emballage Technologies, strengthening its position in the food packaging sector and its presence in the French and other markets.
The US wire and cable manufacturer Lake Cable integrates Sikora measuring devices directly into its extrusion lines to ensure full traceability and stable parameters of high‑performance cables.
Wittmann Group will present at Plastindia 2026 in New Delhi solutions focused on saving energy, material, time and space, including a MicroPower cell for medical micro injection molding, temperature control systems, recycling granulators and the new Primus 118 robot.
Syensqo and Korean company Innores are implementing Tecnoflon FFKM NFS perfluoroelastomers in sealing components for semiconductor manufacturing processes, combining high chemical resistance with the elimination of fluorosurfactants from the PFAS family.
The Wittmann Group has opened its expanded plant in Kunshan, where, in addition to robots and auxiliaries, it will locally produce all-electric EcoPrimus 100 injection molding machines for the Chinese and Asian markets.
A 379.47 kWp photovoltaic system financed by employee cooperative MaGeno-Solar eG has been commissioned at the KHS plant in Worms. The system is expected to supply around 342,000 kWh of electricity per year and reduce CO2 emissions by about 236 metric tons annually.
Increasing regulatory requirements, circular economy targets and digitalisation are transforming industrial packaging solutions. Interpack 2026 will showcase the latest developments in pallets, drums, containers, labelling and measurement systems.
Sumitomo (SHI) Demag and Mapag Maschinen AG will present a fully electric IntElect S injection moulding cell with real-time quality prediction for insulin cap production at Swiss Plastics Expo 2026, highlighting automation, digital connectivity and MES integration.
Hasco has made its entire range of cooling elements available as detailed CAD models, aiming to simplify selection, integration and planning in mould design and to reduce the risk of errors in the development of complex moulds.
EPC Engineering & Technologies and Coperion have developed a one-step direct compounding process for polycarbonate melt that integrates polymerization and compounding, reducing energy use, investment costs and process complexity.
At Plastindia 2026 in New Delhi, BOY and its Indian representative Karan Engineering Co. will present an LSR application on a BOY 50 E injection moulding machine, highlighting high-precision processing of liquid silicone rubber for automotive and electronics components.
Dassault Systèmes and Mistral AI have made the Le Chat Enterprise and AI Studio solutions available in the sovereign Outscale cloud, targeting public administration and regulated sectors in Europe. The offer is aimed at entities that need to combine data protection with the use of generative AI.