Kistler has introduced the NCFQ 2166A high-speed joining system, combining a LinMot linear module with piezoelectric force and acceleration sensing. The turnkey setup targets precise, high-throughput assembly in medical, electronics, semiconductor and automotive applications.
Regulation, sustainability and digitalisation are reshaping pharmaceutical packaging. From PP and PET monomaterial blisters to robotics, high-speed aseptic lines and smart labels, the sector is moving now ahead of PPWR deadlines, with solutions set to feature at interpack 2026.
Trelleborg Sealing Solutions will showcase sealing materials and components for front-end and subfab environments at Semicon Europa, stand 311 in Hall C1, Munich, on November 18 to 21. The company will also outline an expansion of its Malta manufacturing site.
At K 2025 in Düsseldorf, Wittmann Battenfeld introduced a new MacroPower injection molding machine with a one-piece frame in the 400 to 600 t range, aiming to shorten installation, shrink the footprint and improve serviceability, while adding energy-saving features and expanded hydraulics.
Engel introduced the tie-bar-less victory electric injection moulding machine at K 2025, combining electric drives with a redesigned clamping unit. The model targets higher precision, energy efficiency and flexible mould-space utilisation in the clamping force range above 1,300 kN.
The eight-day K 2025 fair in Düsseldorf reported 3,275 exhibitors, more than 175,000 trade visitors from around 160 countries and a 67% share of decision-makers, underscoring its role as a global platform for plastics and rubber.
Envalior spotlights PFAS-free solutions for wear and friction applications at K 2025, with Stanyl PA46 positioned for gears, bearings, seals and bushings alongside testing and simulation support.
At K 2025, Polyvantis will present an ESG-focused strategy built on three pillars, detailing actions in design, manufacturing and resource efficiency, alongside governance and safety commitments.
Syensqo has expanded its non-fluorosurfactant perfluoroelastomer portfolio with new grades rated for continuous operation up to 320°C. The materials target high-purity, high-temperature vacuum service in semiconductor sealing, with variants now available for sampling, trial and commercial use.Syensqo expands market-first non-fluorosurfactant perfluoroelastomer portfolio
Polyvantis has opened a Technology Center in Shanghai, integrating R&D, commercial and manufacturing teams to speed development and response to market needs. The site complements existing centers in Germany, the Netherlands and the United States.
Reifenhäuser introduced a company-wide machine user interface for its extrusion lines and received a German Design Award during K 2025. The unified system spans blown film, flat film and nonwoven lines with an emphasis on simple, intuitive operation.
Pure Loop will debut DynaShape, an intelligent automation package for the Isec evo shredder‑extruder, at K 2025. The company reports up to 10 percent higher productivity and more consistent quality when feed material shape or bulk density varies.
