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KHS presents integrated line and packaging systems at interpack

KHS presents integrated line and packaging systems at interpack

At interpack in Düsseldorf, the KHS Group will present integrated solutions from packaging to complete lines, including the Innopack Kisters Advanced machine with the new resource-saving BottleClip cardboard handle and the innovative PET bottles KHS Supreme and KHS Premium Lite.

Non-food packaging in the spotlight at interpack 2026

Non-food packaging in the spotlight at interpack 2026

Interpack 2026 in Düsseldorf will showcase a wide range of packaging solutions for the non-food sector, with a strong focus on plastic reduction, materials engineering, automation and recycling. Manufacturers will present both new packaging concepts and machinery technologies.

New ISBM technology for lightweight HDPE bottles

New ISBM technology for lightweight HDPE bottles

Polyplastics, Colgate-Palmolive and PTI have developed a new ISBM technology for manufacturing HDPE bottles, enabling significant weight reduction and shorter production cycles while maintaining hot-fill capability.

New French cooling coupling system Hasco Z8012

New French cooling coupling system Hasco Z8012

Hasco has expanded its cooling programme with the modular French coupling system Z8012 for low-temperature cooling circuits in injection moulds. The solution offers full flow, colour coding and an exchangeable sealing ring made of fluorinated rubber.

CEAD reduces 3D printing waste with Weima shredder

CEAD reduces 3D printing waste with Weima shredder

The Dutch company CEAD has integrated a Weima WLK 4 shredder into its large-format 3D printing lines to process thermoplastic composite waste into material for reuse. Research is underway on repalletizing the resulting flakes.

Dassault Systèmes at MWC 2026 on scaling industrial AI

Dassault Systèmes at MWC 2026 on scaling industrial AI

At Mobile World Congress 2026 in Barcelona, Dassault Systèmes will present 3DExperience solutions for scalable artificial intelligence and virtual twins. The offering targets integrated industrial sectors, including data centers, semiconductors and 5G networks.