The Save Food Initiative is officially deepening its cooperation with UNIDO and the World Packaging Organisation, strengthening the role of packaging, processing and industrial innovation in the global fight against food loss and waste. A key platform for presenting these activities will be interpack 2026.
At CFIA 2026 in Rennes, Sidel will present integrated solutions for primary, secondary and tertiary packaging, focusing on line efficiency, product quality and sustainability for the food industry.
At Mobile World Congress 2026 in Barcelona, Dassault Systèmes will present 3DExperience solutions for scalable artificial intelligence and virtual twins. The offering targets integrated industrial sectors, including data centers, semiconductors and 5G networks.
At JEC World 2026, Syensqo will present a composites portfolio for aerospace and automotive applications focused on high-rate manufacturing, sustainable resin systems and circular solutions, including recycling and bio-based feedstocks.
At Warsaw Pack Expo 2026, the adapa Group will present flexible packaging solutions made of mono-PE, mono-PP and paper, designed for recycling in the context of upcoming PPWR requirements.
Indonesia, the largest economy in Southeast Asia, is rapidly developing its plastics market with a focus on sustainable packaging and lightweight components for the automotive sector. EPR regulations and investments in new production capacities are accelerating the transition towards a circular economy.
Xenia Materials announces the launch of Xelamid at JEC World 2026, a family of impact-modified PA11 and PA12-based polyamides featuring increased impact strength, elongation at break and stable properties under elevated humidity conditions.
At Plastindia 2026, BOY and its Indian representative Karan Engineering Co. presented on a BOY 50 E injection moulding machine an application for liquid silicone seals for automotive connectors, attracting strong interest from trade visitors.
At interpack 2026, three halls will be dedicated to processing and packaging technologies for confectionery and baked goods. Sustainable materials, flexible machinery and digital solutions for the confectionery market will be in the spotlight.
MAAG Group and Sikora will present an integrated portfolio of equipment for polymer processing, recycling, and measuring and inspection systems for pipes, hoses, and granules at Chinaplas 2026 in Shanghai.
From 12 to 16 October 2026, the 30th edition of the Fakuma trade fair will take place in Friedrichshafen, presenting the full spectrum of plastics processing technologies. The event focuses on practical solutions, sustainable development and digitalisation.
During the 11th edition of Warsaw Pack 2026, the packaging industry and plastics processing sector will focus on packaging technologies and upcoming PPWR and EPR regulations, analysing their impact on packaging design and production.
