Moretto announces it will present new solutions in drying, gravimetric dosing, material traceability and recycling at Plast 2026 in Milan. The company highlights the importance of in-house research, vertical integration and AI-supported service.
Husky Technologies has introduced HyCAP 4.0 tooling for the injection molding of beverage closures. The solution is intended to support the production of lightweight, regulation-compliant closures while maintaining high productivity, mold durability and lower operating costs.
Clariant reported that in 2025 its catalysts enabled the avoidance of 45 million tonnes of CO2 equivalent emissions. This was 5 million tonnes more than in 2024, with reductions achieved in areas including DRI production, nitric acid and green methanol.
This year's Plastpol edition brought together 660 exhibitors from 36 countries and 15,000 visitors. The event featured live machine demonstrations, contract signing, the 30th anniversary celebrations, and conferences devoted to the future of the industry.
3DForce implemented a 6-axis Dobot CR10A cobot, purchased via the RBTX platform with igus support, to automate the installation of O-rings on fittings. The workstation was also equipped with a vision system, increasing process autonomy and repeatability.
Hubergroup Print Solutions is introducing a new generation of offset inks based on a new resin technology. The company reports reduced misting, fewer make-ready sheets and more stable colour reproduction, including on high-speed presses.
Hasco Group has opened a distribution and logistics centre in the Stryków area. The facility is intended to increase the operational capacity of Procefar and improve the distribution of Hasco-Lek pharmaceutical products, including through automated order picking.
Weidmüller uses BASF's polyphthalamide Ultramid Advanced N3U41 G6 in PCB connectors and terminals from the Omnimate 4.0 family. The material is intended to provide heat resistance for reflow soldering, dimensional stability and broad colouring options.
Asahi Kasei has developed a photosensitive polyimide PSPI film for advanced panel-level semiconductor packaging. The material is intended to improve the lamination of large panels and support the formation of a greater number of insulating layers.
Südpack Medica is developing MedGuard as an integrated packaging system for the medical technology, pharmaceutical and life sciences sectors. The solution combines material selection, process support, technical validation and environmental assessment for sterile packaging.
Groupe Rocher will implement Dassault Systèmes' virtual twin technology to improve the formulation of natural cosmetics. The solution is intended to reduce the number of laboratory tests and shorten the development time of new products by 20%.
Alfa Laval has announced its participation in Posidonia 2026 in Athens. The company will present solutions for alternative fuels, energy efficiency, environmental compliance, ocean protection, as well as service offerings and digital tools for shipping.