Packagings
News Plastech

New Borsoft PP

New Borsoft PP

New Borsoft PP grade makes squeezable tube innovation a reality for cosmetics packaging.

Dow expands manufacturing of chip packaging materials

Dow expands manufacturing of chip packaging materials

Dow announced few days ago that construction is underway in Cheonan, Korea for a new manufacturing and testing facility for metallization materials used in advanced chip packaging. The new capacity adds to the manufacturing infrastructure currently in place at other global Dow sites.