From 24th to 27th April 2018, Moretto S.p.a., Italian provider of wide range of automations and technologies for Material Handling, Drying, Blending, Heat Transfer and Size Reduction equipment, will attend Chinaplas,
The Turkish plastics industry is the largest in the Middle East, accounting for two-thirds (36 per cent) of the region’s demand as of 2015 data, AMI reports, while it holds a geographical advantage, bridging the Middle East with Europe.
From April 24 to 27, WITTMANN BATTENFELD will present latest injection molding technology for the plastics industry to trade visitors at the Chinaplas in Shanghai, the largest plastics fair in Asia.
3rd Industry 4.0 Conference, Tech Talk, Medical Plastics Connect, CMF Inspiration for Design x Innovation
Registration documents now available
To facilitate visitors’ need of sourcing new CHINAPLAS suppliers, a “Young Tech Hall” will be newly introduced at CHINAPLAS 2018. This is a comprehensive exhibition hall, which will gather together new exhibitors from diverse fields.
27th International İstanbul Plastics Industry Fair was organized on 6 - 9 December, 2017 at Tüyap Fair Convention and Congress Center, İstanbul.
Solutions for digitalisation and Industry 4.0 are of critical importance for plastics processors worldwide. Adherence to schedules, cost reduction and resource optimization are requirements that modern manufacturing companies have to face these days.
A Z.PACK 5 blister packaging machine by ZAHORANSKY was installed at a leading contract packer in Baden-Württemberg several months ago.
At the med.con medical technology conference, hosted by ENGEL Deutschland in Hannover, more than 50 medical experts met to exchange experiences and discuss current and future challenges facing the medical technology sector.
ENGEL is making its customers more competitive with flexible and efficient machine concepts along with automation from a single source. The system expert will demonstrate what this means in practical terms by presenting two technically sophisticated applications at Interplastica 2018.
At the Interplastica 2018, to be held in Moscow, ARBURG will present a high-speed thin-wall application for the packaging industry
