DOMO presents polyamide solutions at Plastindia 2026
DOMO Engineered Materials will showcase at Plastindia 2026 reinforced polyamide-based materials for applications requiring low weight, flame and heat resistance, sustainability and water contact.
Electronic and electrical industry
News Plastech
Syensqo perfluoroelastomers in semiconductor applications
Syensqo and Korean company Innores are implementing Tecnoflon FFKM NFS perfluoroelastomers in sealing components for semiconductor manufacturing processes, combining high chemical resistance with the elimination of fluorosurfactants from the PFAS family.
Polyplastics expands Laperos LCP portfolio for electronics
Polyplastics has introduced new Laperos LCP LH and TF series, developed for miniaturization, high flowability and increasing design requirements in electronic components.
BOY showcases LSR injection moulding at Plastindia 2026
At Plastindia 2026 in New Delhi, BOY and its Indian representative Karan Engineering Co. will present an LSR application on a BOY 50 E injection moulding machine, highlighting high-precision processing of liquid silicone rubber for automotive and electronics components.
Plastics in lightweight construction: radiation crosslinking and recycling
Increasing design requirements call for more resistant plastics. Electron beam irradiation can be used to sustainably improve the mechanical, thermal, and chemical properties of plastic components.
RecyClass approves Elix ABS HH 3110 for ABS recycling
Elix ABS HH 3110 has received RecyClass Technology Approval and is recognised as compatible with ABS automotive and EEE recycling streams. The resin is also designated as a control material for RecyClass recyclability testing.
RecyClass approves Dow’s Elvaloy AC 1330 for ABS recycling
RecyClass has issued its first Automotive and EEE Technology Approval to Dow’s Elvaloy AC 1330, confirming full compatibility with the ABS recycling stream under European-like conditions.
Kistler debuts high-speed NCFQ joining system
Kistler has introduced the NCFQ 2166A high-speed joining system, combining a LinMot linear module with piezoelectric force and acceleration sensing. The turnkey setup targets precise, high-throughput assembly in medical, electronics, semiconductor and automotive applications.
Trelleborg showcases latest sealing solutions at Semicon Europa 2025
Trelleborg Sealing Solutions will showcase sealing materials and components for front-end and subfab environments at Semicon Europa, stand 311 in Hall C1, Munich, on November 18 to 21. The company will also outline an expansion of its Malta manufacturing site.
Siemens and Envalior develop bio-based housing for Sirius 3RQ4
Siemens Smart Infrastructure introduced Sirius 3RQ4 coupling relays with housings made from Akulon K225-KS B-MB, a PA6 grade from Envalior containing 70 percent bio-based content sourced from used cooking oil via mass balance. The series offers three variants and meets Siemens EcoTech criteria.
Syensqo expands market-first non-fluorosurfactant perfluoroelastomer portfolio
Syensqo has expanded its non-fluorosurfactant perfluoroelastomer portfolio with new grades rated for continuous operation up to 320°C. The materials target high-purity, high-temperature vacuum service in semiconductor sealing, with variants now available for sampling, trial and commercial use.Syensqo expands market-first non-fluorosurfactant perfluoroelastomer portfolio
Envalior introduces halogen-free PBT for high-voltage connectors
Envalior has unveiled a new halogen-free, flame-retardant PBT, Pocan BFN4232ZHR S1, combining the dimensional stability and electrical insulation of PBT with hydrolysis and creep resistance comparable to polyamide 6 and 66. The grade targets high-voltage connectors, AI data centers and 48 V systems.
