At Chinaplas 2026 in Shanghai, RadiciGroup High Performance Polymers is presenting its portfolio of engineering polymers for automotive, e-mobility, electrical and electronics, as well as industrial and consumer applications. The company is highlighting circular solutions, materials based on renewable feedstock and its local manufacturing base in China.
At Chinaplas 2026 in Shanghai, Mocom will present a portfolio of advanced thermoplastic compounds for automotive, electronics, and sports and leisure applications. The company will showcase, among other things, lighting materials, recycled-content solutions, and lightweight flame-retardant compounds.
DOMO Engineered Materials will showcase at Plastindia 2026 reinforced polyamide-based materials for applications requiring low weight, flame and heat resistance, sustainability and water contact.
Syensqo and Korean company Innores are implementing Tecnoflon FFKM NFS perfluoroelastomers in sealing components for semiconductor manufacturing processes, combining high chemical resistance with the elimination of fluorosurfactants from the PFAS family.
Polyplastics has introduced new Laperos LCP LH and TF series, developed for miniaturization, high flowability and increasing design requirements in electronic components.
At Plastindia 2026 in New Delhi, BOY and its Indian representative Karan Engineering Co. will present an LSR application on a BOY 50 E injection moulding machine, highlighting high-precision processing of liquid silicone rubber for automotive and electronics components.
Increasing design requirements call for more resistant plastics. Electron beam irradiation can be used to sustainably improve the mechanical, thermal, and chemical properties of plastic components.
Elix ABS HH 3110 has received RecyClass Technology Approval and is recognised as compatible with ABS automotive and EEE recycling streams. The resin is also designated as a control material for RecyClass recyclability testing.
RecyClass has issued its first Automotive and EEE Technology Approval to Dow’s Elvaloy AC 1330, confirming full compatibility with the ABS recycling stream under European-like conditions.
Kistler has introduced the NCFQ 2166A high-speed joining system, combining a LinMot linear module with piezoelectric force and acceleration sensing. The turnkey setup targets precise, high-throughput assembly in medical, electronics, semiconductor and automotive applications.
Trelleborg Sealing Solutions will showcase sealing materials and components for front-end and subfab environments at Semicon Europa, stand 311 in Hall C1, Munich, on November 18 to 21. The company will also outline an expansion of its Malta manufacturing site.
Siemens Smart Infrastructure introduced Sirius 3RQ4 coupling relays with housings made from Akulon K225-KS B-MB, a PA6 grade from Envalior containing 70 percent bio-based content sourced from used cooking oil via mass balance. The series offers three variants and meets Siemens EcoTech criteria.
