At Chinaplas 2026 in Shanghai, RadiciGroup High Performance Polymers is presenting its portfolio of engineering polymers for automotive, e-mobility, electrical and electronics, as well as industrial and consumer applications. The company is highlighting circular solutions, materials based on renewable feedstock and its local manufacturing base in China.
Malaysia is strengthening its position as a regional manufacturing hub for the packaging, electronics, medical and automotive industries. Growth in the plastics market is supported by investments in rPET, processing technologies, and packaging and testing capacity.
At Chinaplas 2026 in Shanghai, Mocom will present a portfolio of advanced thermoplastic compounds for automotive, electronics, and sports and leisure applications. The company will showcase, among other things, lighting materials, recycled-content solutions, and lightweight flame-retardant compounds.
Evonik will present high-performance polymers and plastic additives at Chinaplas 2026. The company will showcase solutions for e-mobility, low-altitude aviation, healthcare, 3D printing and plastics recycling.
At Chinaplas 2026, the ENGEL Group will present solutions for the series production of automotive components, focused on reducing part costs, material consumption and investment expenditure. The exhibits will include three applications for the automotive sector.
Kraiburg TPE and SaarGummi have developed a TPE material for automotive sealing systems containing about 56% post-consumer and post-industrial recyclates. The solution is intended to maintain the required quality, processing and functional properties.
ENGEL has converted its long-standing sales partner Roegele into the subsidiary ENGEL Spain, strengthening local support for the Spanish market and access to technology, service and injection moulding solutions.
Xenia Materials introduces the HM Upgrade technology based on high modulus carbon fibres, which increases the stiffness and strength of thermoplastic composites without changing their density, addressing demanding structural applications.
In Japan, the use of recyclates and bioplastics in packaging, automotive and other sectors is growing, while domestic plastics production declines. Regulatory changes, industry initiatives and supply chain restructuring are driving the transformation.
At PIAE 2026, SABIC presented new LNP ELCRIN SLX compounds with PCR content and the thermally conductive LNP KONDUIT WTF2C, as well as other specialty materials for use in ADAS systems, lighting and electric vehicle structures.
ENGEL has developed the two-platen injection moulding machine duo 12000 US with a clamping force of 110,000 kN, designed for producing large-scale parts with a projected area of more than 2.5 m². The solution opens up new possibilities for lightweight design, functional integration and replacing traditional materials with plastics.
At JEC World 2026 in Paris, Envalior will present new Tepex and UDea thermoplastic composites for aviation, drones and hydrogen applications, offering a lightweight, recyclable alternative to thermoset composites.
