https://www.plastech.biz/en/news/tag/novelties-47 · 30.07.2026

Novelties
News Plastech

Mosca and Siat expand partnership in packaging

GroupMosca and Siat Group have signed a strategic agreement to develop a joint offering of integrated packaging systems. The cooperation covers key global markets and is intended to combine both companies' technologies into coherent packaging lines.

packaging industry

Donaldson launches the iCue monitoring system

Donaldson is expanding the use of its iCue Connected Technology to filtration equipment for compressed air, industrial gases and hydraulic fluids. The system is intended to support equipment monitoring, service planning and longer operating life.

filter

Boy to showcase injection moulding machines at Interplas 2026

Together with its UK representative Boy Ltd., Boy will present four injection moulding machines from its current range at Interplas 2026 in Birmingham. The company announces a showcase of energy-efficient solutions for various plastics processing applications.

fairs

1. Plastcompany presented Boy innovations at Plastpol

At the Plastpol trade fair in Kielce, 1. Plastcompany presented three BOY injection moulding machines, including the XS E model for micro injection moulding and the all-electric Boy 100 Electric. The company emphasises strong visitor interest and the importance of comprehensive technical support.

fairs

Sikora launches Line Performance Optimizer software

Sikora has introduced its new Line Performance Optimizer software, designed for early detection of quality fluctuations in cable production. The system uses non-averaged measurement values from measuring devices and the Ecocontrol processor.

software

Amcor launches a 38 mm handle for PET bottles

Amcor has expanded its beverage market portfolio with a 38 mm handle for PET containers. The solution is intended for bottles with a capacity of up to 10 litres, used mainly for water and other non-carbonated beverages.

packagings

Asahi Kasei develops new PSPI film

Asahi Kasei has developed a photosensitive polyimide PSPI film for advanced panel-level semiconductor packaging. The material is intended to improve the lamination of large panels and support the formation of a greater number of insulating layers.

novelties