Rinco Ultrasonics will present the FPA4500EM servo-driven pouch sealer and the Micro-35 packaging actuator at Pack Expo International 2025 in Las Vegas. The systems target energy-efficient ultrasonic fin sealing, zipper crushing and high-speed pouch sealing.
At this year's K trade fair, the world's leading supplier for laser plastic welding will be presenting the latest technologies such as the Evo2Step process and absorption measurement.
Rinco demonstrates energy saving capability of Servo-Driven Ultrasonic Welding Systems in new automotive application
Faced with rising energy costs, many companies have set themselves the target of saving electricity.
With its compact and fully automatic T 305, Multivac is launching a new traysealer, which is characterised by its high level of performance, pack quality and flexibility.
Since the beginning of the year, Evosys Laser - with its representatives TRUmachines in Poland and Tamsa Makina in Turkey - has strengthened its global presence.
28th International Istanbul Plastics Industry Fair brought together 1,094 companies and company representatives from 44 countries and 51,684 professional visitors from 103 countries on the 5th-8th of December in Istanbul.
Almost three years after its founding, Evosys Laser GmbH celebrates the successful move to new premises. In addition to the increase in the number of employees, expansion areas were leased in particular.
Why do snap hooks made of POM have far better functional qualities then those with additive printing? Find out at the Spanish trade In(3D)ustry in Barcelona which runs from the 16th till the 18th of October in Barcelona.
More than 1.000 guests invited by Erema made their way to Ansfelden, Austria, for the Discovery Days 2018 from 27 to 29 June. Well-known companies from the plastics sector, such as Borealis, Engel, Greiner, Haidlmair and Henkel gave participants an insight into their view of working with plastics in a sustainable way.
Three-dimensional joining of large parts is often difficult to implement.
With ultrasonics it is possible to solve a variety of joining tasks for instrument clusters.
