In the past year, the scientific community has seen a surge in the use of terms such as 5G, curved monitors, foldable screen, artificial intelligence, virtual reality, the Internet of Things (IoT) and big data. This rapid technological development is helping consumers to experience increasing conveniences in their lives. The number of tasks that can be performed with the Internet-connected device in our hand is beyond imagination. Innovation is changing our lives.
As manufacturing technology constantly advances, various electronic products keep rolling out, dazzling users with a broad range of intelligent hardware and devices. These products are in the form of smartphones, intelligent wearables, smart home devices, connected vehicles, advanced medical and healthcare equipment, intelligent unmanned systems, and so on.
Chinaplas 2019, a technology-oriented and innovation-driven trade fair, will return to the China Import and Export Fair Complex, Pazhou, Guangzhou, and run from May 21-24, 2019. The show will attract more than 3,500 leading exhibitors from all over the world, 1,100 of which will introduce state-of-the-art equipment and materials for the electrical and electronics industries. This strong line-up of exhibitors includes BASF, DuPont, Teijin, Sumitomo Chemical, Mitsubishi Chemical, LG Chem, SK Chemicals, Eckart, Arburg, ABB, Haitian, Chen Hsong, Engel, Brueckner, Topstar, Bohler, Fanuc, Sodick, FCS, Motan-Colortronic and Davis-Standard. They will showcase high-performance, trendy, environmentally friendly and versatile materials, as well as intelligent manufacturing solutions, including automated equipment, high-end robots, visual systems, 3D printing, and other advanced technologies, that can assist enterprises in achieving sustainable development.
High-performance materials for innovative electronics manufacturing
With the dawn of the era for 5G (fifth-generation wireless cellular technology), we are all excited about how plastics can be incorporated into new mobile phones and other wireless devices, as well as 5G base stations. At Chinaplas 2019, Seyang Polymer will showcase Seyang LCP, a material for 5G communication components. The material achieves low/high dielectric property ratings, LDS/MID grades for 5G antennas, and excellent extrusion grades for liquid crystal polymer (LCP) films. Shanghai Afaith Trading Co., Ltd. will introduce a polycarbonate-based material with a high dielectric constant, which can be widely used in small antennas and in particular in 5G communication applications.
New high-performance composite materials have now become the top choice for producing small, lightweight and portable electronic products. Chonqing Polycomp International Corp. will display a thermally resistant glass fiber (ECS303HR) designed and developed for polybutylene (PBT) plastics. This type of fiber is highly reactive and can enhance the interfacial bonding strength between glass fiber and PBT resin. After aging in 120℃ hot water, ECS303HR has an overall retained strength 20% higher than other common glass fibers, demonstrating its excellent thermal resistance and mechanical strength.
Zhejiang Xinan Chemical Industrial Group Co., Ltd. will exhibit an innovative foamed liquid silicone rubber, which can be widely applied to outdoor equipment protection, for cushioning electronic equipment and so forth. The product has a flame-retardant grade of V0. It not only has the lightweight properties of foam and the impermeability of traditional sponges but also is as safe and environmentally friendly as silica gel.
Moreover, Japan's Teijin Ltd. has developed a thermoplastic carbon fiber prepreg by combining their carbon fiber with thermoplastic resins like PC, polyethersulfone (PES) and polypropylene (PP). Compared to traditional metal and thermoplastic carbon fiber prepregs, the product is flame retardant, impact resistant, easy to shape, storable at room temperature, and suitable for large-scale mass production (with short production cycle times). It offers a good appearance, at lower overall cost, and can be widely used in, for example, the electrical and electronics, automotive, construction and medical fields.