Chinaplas 2019 outlining a bright future for the packaging industry

Chinaplas 2019 outlining a…

Driven by the dynamic economic development, accelerating urbanization and improvement in people’s quality of life, the consumer market has a surging demand for safe, convenient, unique and environmentally friendly packaging. Meanwhile, the packaging industry is in a difficult position due to more stringent VOC regulations, fluctuating raw material prices, regional industrial transfer, uncontrollable costs, and recruitment difficulty. In light of the increasingly diverse user requirements and fierce market competition with more homogeneous products, the packaging industry has a pressing need for transformation and upgrading.

With the growing complexity of the business environment, how can one read the market trend, adapt to changes with technological innovations, and thus find a way out? Chinaplas 2019, a technology-oriented and innovation-driven trade fair, provides an international platform for showcasing and exchanging advanced technology. The show has a large display of innovative solutions featuring cutting-edge materials, machines, and technology, spotlighting customized, green, functional and intelligent manufacturing with reduced cost and improved efficiency, which helps packaging enterprises stand out.

Customized packaging in great demand under the new consumption trend

The packaging industry is playing an increasingly critical role across various sectors. Brands are looking for crowd-pulling customized packaging. Whether packaging can serve as the driving force behind a brand and how it becomes an important means for enterprises to implement their business strategies are currently hot topics in the industry.

Compared to Europe, the US, Japan, and other countries, China is a late starter in the packaging industry, which, however, has grown to a fairly large-scale industry over the past few decades. And thanks to China’s 40 years of reform and opening-up, the income and living standard of people in the country have improved significantly. As a result, the market has a rising demand for technology that helps deal with small and customized orders in a precise, quick and flexible manner, and brands are going through substantial upgrades with unprecedented frequency. The importance of packaging to products is growing exponentially.

HP Inc. will present its Indigo digital printing solutions for flexible packaging at Chinaplas 019, provides a timely solution of on-demand customization, enhancing product value through personalization. The digital printing technology can be employed to shorten delivery lead time, boost business growth, save costs, streamline work processes, achieve automated prepress workflow, and directly increase profits. HP Indigo supports one-pass printing to allow the use of micro-text, anti-counterfeiting and traceability solutions, and special inks. HP Indigo 20000 Digital Press can be used for manufacturing labels and packaging. With a printing speed up to 42 m/min in color mode and a maximum web width of 76 cm, the press can address SKU diversity and operate per specific requirements. It has a print quality comparable to gravure printing and meets the safety standard for food packaging.

GDXL Precise Machinery Co., Ltd.’s multilayer co-injection solution allows a gradual color change along the preform, enriching the possibilities for product designs. The solution can be achieved by modifying existing injection equipment into a co-injection system to achieve multilayer manufacturing. It enhances the insulation of containers and extends their durability to the maximum extent (about 200% of those packed in monolayer containers). This technology is applicable to the packaging markets of beverage, food, cosmetics, and even pharmaceutical products.

Autodesk Software (China) Co. Ltd. will showcase a 3D modeling software, Moldflow 2020. Moldflow injection molding analysis software helps users validate and improve plastic part design, injection mold design, and injection molding processes by predicting the process, mold temperature and resulted warpage. The analysis results will be shared to achieve collaboration with the supply chain, which can reduce the development time of projects, speed up the manufacturing of high-quality parts, and improve molding solutions.


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