SABIC has announced another incremental expansion phase for the production of its specialty oligomers based on polyphenylene ether (PPE) technology. The new capacity is intended to respond to rapidly increasing demand for high-performance printed circuit boards (PCBs) used in data centers that support artificial intelligence (AI) and 5G applications. The expansion follows earlier capacity increases in Asia and is part of the company’s broader commitment to materials for advanced electronics infrastructure.
According to Sergi Monros, vice president, SABIC Polymers, Specialties BU, the spread of AI across sectors is reshaping requirements for data center hardware and materials. He stated that as AI is integrated into virtually every industry and environment, the data center market requires material solutions that can support high-speed, high-bandwidth, low-latency infrastructure while enabling new levels of performance and reliability. In addition to investing in specialty materials and services to accelerate product development in this field, Sabic maintains a dedicated patent portfolio to protect the intellectual property behind solutions developed in cooperation with customers.
PPE oligomers for high-performance PCB laminates
The latest PPE oligomer capacity expansion is scheduled for completion in the second half of 2026. It is expected to help PCB manufacturers maintain short lead times as demand for their products increases in line with the growth of AI and 5G data center infrastructure. Within this segment, SABIC highlights Noryl SA9000 as its flagship material. This grade is a modified, low-molecular-weight, bi-functional PPE oligomer designed for high-performance multilayer copper-clad laminates (CCLs) used in 5G base stations and high-speed AI server PCBs.
Noryl SA9000 is engineered for applications that combine high heat resistance, dimensional stability and flame retardancy with increased layer-count capability. These properties are intended to support the development of very low-loss CCL products with enhanced dielectric layer strength. The grade also offers formulating flexibility in existing CCL production operations and has been proven suitable for incorporation into various solvent-based thermoset systems.
By targeting the dielectric performance and reliability demands of multilayer PCB constructions in AI and 5G environments, SABIC’s PPE oligomer portfolio is positioned as a material option for laminate producers seeking to optimize high-speed signal integrity and thermal performance under demanding operating conditions.
Specialty materials for AI and 5G data centers
Electronics for AI and 5G data centers typically concentrate high processing power and connectivity within confined spaces, which places stringent demands on material performance for both electronic and structural components. Beyond PPE oligomers for PCB laminates, Sabic offers a range of specialty resins and compounds for data center applications that combine attributes such as low weight, mechanical strength, thermal and electrical conductivity, optical clarity, chemical resistance and cooling capability.
The portfolio referenced for AI data centers includes the following material families and indicative application areas:
- Ultem resins for components such as cooling fans, liquid cooling connections, signal connectors and on-board optics.
- Noryl resins for air and cable guides.
- LNP Faradex compounds for EMI shielding applications.
- LNP Stat-kon compounds for anti-static components.
- LNP Elcres copolymers for busbar covers.
These materials are intended to support the design and engineering of next-generation data center hardware where electrical performance, thermal management and mechanical robustness must be balanced within compact system layouts for AI and 5G workloads.
Further information about SABIC’s product offering for AI-focused data centers is communicated by the company via dedicated information channels.
