"The Formnext is an ideal platform to strengthen our positioning as partner for end to end 3D printing processes - for prototyping as well as for applications in the production of final parts", explained Philipp Loosen, Head of 3D Printing at Henkel. "We will present the market launch of our open system including a new generation of resin platforms customized for various printing purposes. In addition, we will also showcase the expansion of our broad enabling portfolio, for example our new Loctite adhesives suitable for the majority of bonding applications in post-processing."
Differentiated resin platformsHenkel will launch differentiated new engineering resin platforms during the Formnext 2018: General Purpose, Flexible, High Temperature, Durable High Impact, Ultra Clear and Silicone Elastomeric. The next-generation materials are designed to enable and optimize 3D Printing and manufacturing processes according to required functionalities and designs.
As an enabler for the resins, Henkel will also introduce its new Loctite 3D Printer and equipment for functional prototyping applications at an entry-level. For small-run production and industrial manufacturing of final parts the company is collaborating with various technology leaders such as HP Inc. and others.
New General Bonding KitHenkel will also launch its first General Bonding Kit for 3D Printing applications. The kit consists of Loctite 3D Printing Universal Bonder and the Loctite 3D Printing Instant Bonder as well as activators, primers and cleaning products. The kit aims to easily support customers in bonding prototyping parts for the most-known 3D Printing technologies. In addition, Henkel offers bonding solutions for the industrial series production of 3D printed parts. The company also plans to set-up bonding trainings for industrial users via tutorials and webinars soon.